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LED High Thermal Conductivity Aluminum Substrate

The LED high thermal conductivity aluminum substrate is a heat dissipation solution designed specifically for LED lighting. It mainly uses aluminum alloy as the substrate and combines high thermal conductivity materials and structural design to ensure effective heat dissipation for LEDs operating at high power, thereby extending the LED's service life and improving light efficiency.
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Its excellent thermal conductivity makes it an indispensable component in the LED lighting industry, widely used in high-power LEDs, backlight sources, automotive lighting, stage lighting, and other fields.


Overview of the product.

The LED high thermal conductivity aluminum substrate is mainly composed of aluminum alloy substrate, insulation layer, and copper layer. The aluminum substrate serves as the basic material, possessing excellent thermal conductivity, mechanical strength, and corrosion resistance. The insulation layer effectively isolates the circuit to avoid electrical short circuits. The copper layer or metallization layer can further improve the heat conduction efficiency, ensuring that the heat generated by the LED chip under high power drive can be quickly dissipated, thereby enhancing the light efficiency and stability of the LED.

Due to the good heat dissipation performance of aluminum substrate, it is particularly suitable for high-power and high-heat LED applications, widely used in various industries such as lighting, automotive, displays, and backlighting.


Main features

Excellent thermal conductivity: Aluminum substrate has a high thermal conductivity coefficient (usually between 2.0-3.0 W/m·K), which can quickly conduct the heat generated by LED chips, thereby preventing LED from overheating and improving heat dissipation efficiency.

High strength and corrosion resistance: Using aluminum alloy as the base material, it has high resistance to mechanical impact and the surface of aluminum alloy is easy to form an aluminum oxide layer, which has good corrosion resistance and is suitable for long-term use.

Lightweight and efficient heat dissipation design: The aluminum substrate is lightweight and easy to process, and can be designed in various ways (such as adding surface fins, adopting a multi-layer structure, etc.) to further improve heat dissipation efficiency and reduce heat accumulation.

Electrical insulation: The insulation layer on the substrate can effectively prevent short circuits and electrical faults, ensuring the stability and safety of the LED driver circuit.

Long lifespan and high reliability: Good heat management can prevent LED luminaires from overheating, reducing light decay and early failure caused by overheating, thereby improving their lifespan.


Summary.

With its excellent thermal conductivity, good mechanical strength, and corrosion resistance, LED high thermal conductivity aluminum substrate has become a key thermal management component in LED lighting and other high-power LED applications. Through efficient heat dissipation design, LED high thermal conductivity aluminum substrate effectively extends the service life of LED products and improves their luminous efficiency and stability. With the development of LED technology and the increasing demand in the market, the application prospects of LED high thermal conductivity aluminum substrate in various lighting and display fields are extensive, making it an indispensable basic material for modern efficient and energy-saving lighting technology.


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Guangdong Anlv New Material Co., Ltd. is a modern enterprise focusing on the research and development and manufacturing of precision pre-treated aluminum plates.

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